As I mentioned before, both mating surfaces should be coated with a thin even coat of heatsink compound. With a thin coat, there would be no danger of any excess getting into the IC pins area. I would not rely on most heatsink mounting methods to cause a 'blob' of the material centered in the middle of the CPU to spread out and coat all surface areas uniformly. This has been especially true with my tube of Thermalloy Z9, which is the white, zinc oxide type. It comes out of the tube fairly thick. I have found it is best to start with a small blob in the middle of each surface (both CPU and heatsink) and by using a patting motion with the forefinger, gradually cause the material to spread out and uniformly cover the entire surface with a fairly thin film. I think it is very important to make sure to coat both mating surfaces. The thermal conductivity of any IC/CPU surface area not coated with the compound should be, by all rights, significantly lower, and this can only harm cooling overall. The key here is to keep the coating thin. Too thick might be as bad as none at all.