I just put together an Athlon 2000 XP system. I tried to tackle the heat probs in Advance, i.e, Lian Li case, thermalright SK6 heatsink which I lapped, arctic silver III paste paper thin, round IDE cables. I even modded the case slightly as the rear case grill was slowing air flow (in my view the one weak point of this case), so I cut it out with a dremmel and replaced it with a finer one. My only concession was to use a 4500rpm thermaltake fan on the CPU as I didn't want a lot of noise.
At first my impression of the sytem was great: Ambient 27C (I have no AC), case 32C, CPU 47C idle to 53C at 100%, which it maintained for days. Good enough I thought. But over the following 4 weeks the CPU temp has crept up: Now 51C idle - 55C @ 100%. Case & ambient temp are the same. Yes, I know an extra 4C is not life and death, just annoying having gone to so much trouble, and a bit worrying not knowing the cause. What can have changed?
For what it's worth, here are my few brainstormed ideas: 1)Thermal paste was too thin initially and has somehow changed physically with heat/time to reduce the contact area (I followed the website instructions to the letter). 2) The CPU is doing different things as I have added software to the system. I read somwhere that it can switch into different activity states, even when idle, which is the basis behind certain cooling software. 3) Unseen dust between the heatsink vanes has reduced heat convection (I checked the intake filter, which is pretty clean).
Incidentally, the system under W2K is rock stable, so perhaps I shouldn't care less.
I would really like to know what the experts think. Have I missed somthing?
Thanx in advance,
Rubic
At first my impression of the sytem was great: Ambient 27C (I have no AC), case 32C, CPU 47C idle to 53C at 100%, which it maintained for days. Good enough I thought. But over the following 4 weeks the CPU temp has crept up: Now 51C idle - 55C @ 100%. Case & ambient temp are the same. Yes, I know an extra 4C is not life and death, just annoying having gone to so much trouble, and a bit worrying not knowing the cause. What can have changed?
For what it's worth, here are my few brainstormed ideas: 1)Thermal paste was too thin initially and has somehow changed physically with heat/time to reduce the contact area (I followed the website instructions to the letter). 2) The CPU is doing different things as I have added software to the system. I read somwhere that it can switch into different activity states, even when idle, which is the basis behind certain cooling software. 3) Unseen dust between the heatsink vanes has reduced heat convection (I checked the intake filter, which is pretty clean).
Incidentally, the system under W2K is rock stable, so perhaps I shouldn't care less.
I would really like to know what the experts think. Have I missed somthing?
Thanx in advance,
Rubic